U-Probe
Features
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U-Probe
U-Probe refers to probe cards that use a micro cantilever — a MEMS probe developed by applying our proprietary MEMS technology — and the technology for manufacturing thin-film multi-layer wiring substrates.
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01Simultaneous multi-die testing probe card for DRAM and Flash Memory devices
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02U-Probe refers to probe cards that use a micro cantilever — a MEMS probe developed by applying our proprietary MEMS technology — and the technology for manufacturing thin-film multi-layer wiring substrates.
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03Supports one-touchdown testing of 12-inch wafers
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04A single card can support approximately 2,500 DUTs and approximately 200,000 mounted pins
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05Efficient DUT array with maximum use of tester resources
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06Optimal connectivity for improved yield
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PCB less Type
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01Lightweight and cost-efficient due to its direct docking of the thin-film multilayer substrate with MEMS probes and tester.