Test Sockets for BGA
Features
BeeContacts
BGA
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01Scrub action reduces solder transfer
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02Highly durable and long life
| BeeContacts | Pin Type | |||
|---|---|---|---|---|
| B4-L3.3 | B4-L3.3HC | B4-L3.85 | B3.5-L3.3 | |
| PKG Type | BGA・CSP | |||
| Pad Pitch | ＞0.4mm | ＞0.35mm | ||
| Pad Material | Sn・SAC | |||
| Frequency | 〜14GHz | ～11GHz | ～19GHz | |
| Current | 2.5A | 2.2A | ||
| Temperature | -40℃～125℃ | RT～125℃ | -40℃〜125℃ | |
