MEMS-SP

Features

MEMS-SP refers to vertical-spring-type probe cards using a MEMS probe.

01Probe card for logic devices suited for fine pitch bump testing
02Best suited to flip chip wafer testing of microprocessors and SoC devices
03Allows easy single-pin replacement for superior maintenance
04Customizable probe tip configuration
05Can also be used for high-frequency direct docking systems for advanced microprocessors
063D spiral spring probe created using photolithography
07Manufactured using MEMS technology to minimize scatter, providing high precision and highly reliable testing